參數(shù)資料
型號: MCIMX253CJM4
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, MICROPROCESSOR, PBGA400
封裝: 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400
文件頁數(shù): 138/154頁
文件大?。?/td> 1498K
代理商: MCIMX253CJM4
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
84
Freescale Semiconductor
3.7.8
Enhanced Secured Digital Host Controller (eSDHCv2) Timing
Figure 54 shows eSDHCv2 timing, and Table 61 describes the timing parameters (SD1–SD8) used in the
figure. The following definitions apply to values and signals described in Table 61:
LS: low-speed mode. Low-speed card can tolerate clocks up to 400 kHz
FS: full-speed mode. Full-speed MMC card’s clock can reach 20 MHz; full speed SD/SDIO card
clock can reach 25 MHz
HS: high-speed mode. High-speed MMC card’s clock can reach 52 MHz; SD/SDIO card clock can
reach 50 MHz
86
SCKT rising edge to data out valid
18.0
13.0
x ck
i ck
ns
87
SCKT rising edge to data out high
impedance6
——
21.0
16.0
x ck
i ck
ns
88
SCKT rising edge to transmitter #0 drive
enable negation6
——
14.0
9.0
x ck
i ck
ns
89
FST input (bl, wr) setup time before SCKT
falling edge5
——
2.0
18.0
x ck
i ck
ns
90
FST input (wl) setup time before SCKT falling
edge
——
2.0
18.0
x ck
i ck
ns
91
FST input hold time after SCKT falling edge
4.0
5.0
x ck
i ck
ns
92
FST input (wl) to data out enable from high
impedance
——
21.0
ns
93
FST input (wl) to transmitter #0 drive enable
assertion
——
14.0
ns
94
Flag output valid after SCKT rising edge
14.0
9.0
x ck
i ck
ns
95
HCKR/HCKT clock cycle
2 x TC
15
ns
96
HCKT input rising edge to SCKT output
18.0
ns
97
HCKR input rising edge to SCKR output
18.0
ns
1 V
CORE_VDD = 1.00 ± 0.10 V; TJ = –40 °C to 125 °C, CL = 50 pF
2 In the “Characteristics” column, bl = bit length, wl = word length, wr = word length relative
3 In the “Expression” column, T
C = 7.5 ns.
4 For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.
5 The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync
signal waveform, but spreads starting from one serial clock before the first bit clock (same as the bit length frame sync signal),
until the second-to-last bit-clock of the first word in the frame.
6 Periodically sampled and not 100% tested.
Table 60. ESAI General Timing Requirements (continued)
No.
Characteristics1 2
Symbol
Expression3
Min.
Max.
Condition
Unit
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MCIMX253CJM4A 功能描述:處理器 - 專門應(yīng)用 IMX25 1.2 INDUST RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX253CVM4 功能描述:處理器 - 專門應(yīng)用 SENNA IMX25 1.1 INDUSTRIAL RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX253DJM4 功能描述:處理器 - 專門應(yīng)用 SENNA IMX25 COMM RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX253DJM4A 功能描述:處理器 - 專門應(yīng)用 IMX25 1.2 COMM RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX253DVM4 功能描述:IC MPU I.MX25 COMM 400MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:i.MX25 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:260 系列:73S12xx 核心處理器:80515 芯體尺寸:8-位 速度:24MHz 連通性:I²C,智能卡,UART/USART,USB 外圍設(shè)備:LED,POR,WDT 輸入/輸出數(shù):9 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-VFQFN 裸露焊盤 包裝:管件