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參數(shù)資料
| 型號(hào)： | MCIMX27MJP4A |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA473 |
| 封裝： | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473 |
| 文件頁(yè)數(shù)： | 105/152頁(yè) |
| 文件大?。?/td> | 3889K |
| 代理商： | MCIMX27MJP4A |
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i.MX27 and i.MX27L Data Sheet, Rev. 1.6
56
Freescale Semiconductor
Electrical Characteristics
4.3.1
Direct Memory Access Controller (DMAC)
After assertion of External DMA Request the DMA burst will start when the corresponding DMA channel
becomes the current highest priority channel. The External DMA Request should be kept asserted until it
is serviced by the DMAC. One External request will initiate at least one DMA burst.
The output External Grant signal from the DMAC is an active-low signal. This signal will be asserted
during the time when a DMA burst is ongoing for an External DMA Request, when the following
conditions are true:
The DMA channel for which the DMA burst is ongoing has requested source as external DMA
Request (as per RSSR settings).
REN and CEN bit of this channel are set.
External DMA Request is asserted.
Once the grant is asserted the External DMA Request will not be sampled until completion of the DMA
burst. The priority of the external request will become low, for the next consecutive burst, if another DMA
request signal is asserted.
The waveforms are shown for the worst case—that is, smallest burst (1 byte read/write). Minimum and
maximum timings for the External request and External grant signal are present in the data sheet.
Figure 15 shows the minimum time for which the External Grant signal remains asserted if External DMA
request is de-asserted immediately after sensing grant signal active.
Figure 15. Assertion of DMA External Grant Signal
Figure 16 shows the safe maximum time for which External DMA request can be kept asserted, after
sensing grant signal active such that a new burst is not initiated.
Figure 16. Timing Diagram of Safe Maximums for External Request De-Assertion
Ext_DMAReq
Ext_DMAGrant
tmin_assert
Ext_DMAReq
Data read from
External device
Data written to
External device
Ext_DMAGrant
tmax_write
tmax_read
tmax_req_assert
NOTE: Assuming worst case that the data is read/written from/to external device as per the above waveform.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCIMX27MJP4AR2 | 功能描述:處理器 - 專(zhuān)門(mén)應(yīng)用 Bono 19x19 FG RoHS:否 制造商:Freescale Semiconductor 類(lèi)型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX27MOP4A | 功能描述:處理器 - 專(zhuān)門(mén)應(yīng)用 BONO 19X19 FG RoHS:否 制造商:Freescale Semiconductor 類(lèi)型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX27MOP4AR2 | 功能描述:處理器 - 專(zhuān)門(mén)應(yīng)用 BONO 19X19 R2 RoHS:否 制造商:Freescale Semiconductor 類(lèi)型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX27PDKCPU | 功能描述:開(kāi)發(fā)板和工具包 - ARM I.MX27 PDK CPU BOARD RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類(lèi)型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
| MCIMX27V0P4A | 制造商:Rochester Electronics LLC 功能描述: 制造商:Freescale Semiconductor 功能描述: |
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