參數(shù)資料
型號: MCIMX27MOP4A
廠商: Freescale Semiconductor
文件頁數(shù): 36/152頁
文件大?。?/td> 0K
描述: IC MPU I.MX27 19X19 473MAPBGA
標準包裝: 84
系列: i.MX27
核心處理器: ARM9
芯體尺寸: 32-位
速度: 400MHz
連通性: 1 線,CAN,EBI/EMI,以太網(wǎng),I²C,MMC,智能卡,SPI,SSI,UART/USART,USB OTG
外圍設(shè)備: DMA,LCD,POR,PWM,WDT
程序存儲器類型: ROMless
RAM 容量: 45K x 8
電壓 - 電源 (Vcc/Vdd): 1.38 V ~ 1.52 V
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 473-LFBGA
包裝: 托盤
i.MX27 and i.MX27L Data Sheet, Rev. 1.8
130
Freescale Semiconductor
Package Information and Pinout
5.4
Pin Assignments (19 mm
× 19 mm)
Table 61 shows the i.MX27 full 19
× 19 mm package MAPBGA pin assignment.
Table 62 identifies the pin assignments for the ball grid array (BGA) for full package. The connections of
these pins depend solely upon the user application, however there are a few factory test signals that are
not used in a normal application. Following is a list of these signals and how they are to be terminated for
proper operation of the i.MX27/MX27L processor:
CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
EXT_60M: To ensure proper operation, connect this signal to ground.
EXT_266M: To ensure proper operation, connect this signal to ground.
Most of the signals shown in Table 62 are multiplexed with other signals. For ease of reference, all
of the signals at a particular pad are shown in the form of a compound signal name. Refer to Table 3
for complete information on the signal multiplexing schemes of these signals.
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