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參數(shù)資料
| 型號(hào)： | MCM63P818ZP66R |
| 廠商： | MOTOROLA INC |
| 元件分類： | DRAM |
| 英文描述： | 128K x 36 and 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM |
| 中文描述： | 256K X 18 CACHE SRAM, 7 ns, PBGA119 |
| 封裝： | PLASTIC, BGA-119 |
| 文件頁數(shù)： | 26/27頁 |
| 文件大?。?/td> | 328K |
| 代理商： | MCM63P818ZP66R |
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MCM63P636
26
MOTOROLA FAST SRAM
TQ PACKAGE
TQFP
CASE 983A–01
DIM
A
A1
A2
b
b1
c
c1
D
D1
MIN
–––
0.05
1.35
0.22
0.22
0.09
0.09
22.00 BSC
20.00 BSC
MAX
1.60
0.15
1.45
0.38
0.33
0.20
0.16
MIN
–––
0.002
0.053
0.009
0.009
0.004
0.004
0.866 BSC
0.787 BSC
MAX
0.063
0.006
0.057
0.015
0.013
0.008
0.006
INCHES
MILLIMETERS
E
E1
e
L
L1
L2
S
R1
R2
16.00 BSC
14.00 BSC
0.65 BSC
0.45
1.00 REF
0.50 REF
0.20
0.08
0.08
0
0
11
11
0.630 BSC
0.551 BSC
0.026 BSC
0.018
0.039 REF
0.020 REF
0.75
0.030
–––
–––
0.20
7
–––
13
13
0.008
0.003
0.003
–––
–––
0.008
0
0
11
11
7
–––
13
13
1
2
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS D1 AND B1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE b DIMENSION TO EXCEED 0.45
(0.018).
A–B
0.20 (0.008) H
e
D
A–B
0.20 (0.008) C
D
A–B
0.20 (0.008) C
D
0.10 (0.004) C
0.25 (0.010)
S
0.05 (0.002)
S
A–B
M
0.13 (0.005)
D
S
C
e/2
D/2
E
E1
D1
D
D1/2
E1/2
E/2
4X
2X 30 TIPS
2X 20 TIPS
–D–
–B–
–A–
–C–
SEATING
–H–
1
3
2
100
81
80
51
50
31
30
1
PLATING
SECTION B–B
c1
c
b1
éééé
éééé
METAL
A
VIEW AB
S
VIEW AB
A2
A1
R1
L2
L
L1
R2
GAGE PLANE
–X–
X=A, B, OR D
VIEW Y
B
B
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