參數(shù)資料
型號: MCP1603
廠商: Microchip Technology Inc.
英文描述: 2.0 MHz, 500 mA Synchronous Buck Regulator
中文描述: 2.0兆赫,500毫安同步降壓穩(wěn)壓器
文件頁數(shù): 11/26頁
文件大?。?/td> 672K
代理商: MCP1603
2007 Microchip Technology Inc.
DS22042A-page 11
MCP1603
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in
Table 3-1
.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Power Supply Input Voltage Pin
(V
IN
)
Connect the input voltage source to V
IN
. The input
source must be decoupled to GND with a 4.7 μF
capacitor.
3.2
Ground Pin (GND)
Ground pin for the device. The loop area of the ground
traces should be kept as minimal as possible.
3.3
Shutdown Control Input Pin
(SHDN)
The SHDN pin is a logic-level input used to enable or
disable the device. A logic high (> 45% of V
IN
) will
enable the regulator output. A logic-low (< 15% of V
IN
)
will ensure that the regulator is disabled.
3.4
Feedback / Output Voltage Pin
(V
FB
/V
OUT
)
For adjustable output options, connect the center of the
output voltage divider to the V
FB
/V
OUT
pin. For fixed-
output voltage options, connect the output directly to
the V
FB
/V
OUT
pin.
3.5
Switch Node, Buck Inductor
Connection Pin (L
X
)
Connect the L
X
pin directly to the buck inductor. This
pin carries large signal-level current; all connections
should be made as short as possible.
3.6
Exposed Metal Pad (EP)
For the DFN package, connect the Exposed Pad to
GND, with vias into the GND plane. This connection to
the GND plane will aid in heat removal from the
package.
Pin No.
Symbol
Description
MCP1603
TSOT23
MCP1603L
TSOT23
2x3 DFN
1
2
3
4
5
4
2
1
5
3
7
8
3
4
1
V
IN
GND
SHDN
V
FB
/V
OUT
L
X
NC
EP
Power Supply Input Voltage Pin
Ground Pin
Shutdown Control Input Pin
Feedback / Output Voltage Pin
Switch Node, Buck Inductor Connection Pin
No Connect
For the DFN package, the center exposed pad is a thermal
path to remove heat from the device. Electrically this pad is at
ground potential and should be connected to GND
2, 5, 6
Exposed
Pad
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