參數(shù)資料
型號: MCP2022P-500E/SL
廠商: Microchip Technology
文件頁數(shù): 41/52頁
文件大?。?/td> 0K
描述: IC TXRX LIN ON-BOARD VREG 14SOIC
產(chǎn)品培訓(xùn)模塊: Microchip MCP20xx LIN Transceiver Overview
標(biāo)準(zhǔn)包裝: 57
系列: *
MCP2021/2/1P/2P
DS22018F-page 46
2005-2012 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
0.65 BSC
Overall Height
A
1.20
Molded Package Thickness
A2
0.80
1.00
1.05
Standoff
A1
0.05
0.15
Overall Width
E
6.40 BSC
Molded Package Width
E1
4.30
4.40
4.50
Molded Package Length
D
4.90
5.00
5.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
Lead Thickness
c
0.09
0.20
Lead Width
b
0.19
0.30
NOTE 1
D
N
E
E1
1 2
e
b
c
A
A1
A2
L1
L
φ
Microchip Technology Drawing C04-087B
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