參數(shù)資料
型號: MCP2140-I/P
廠商: Microchip Technology
文件頁數(shù): 39/58頁
文件大?。?/td> 0K
描述: IC IRDA CONTROLLER DTE/DCE 18DIP
產(chǎn)品培訓(xùn)模塊: IrDA® Standard Protocol
標(biāo)準(zhǔn)包裝: 25
控制器類型: IRDA 標(biāo)準(zhǔn)協(xié)議棧控制器
接口: UART
電源電壓: 3 V ~ 5.5 V
電流 - 電源: 2.2mA
工作溫度: -40°C ~ 125°C
安裝類型: 通孔
封裝/外殼: 18-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 18-PDIP
包裝: 管件
產(chǎn)品目錄頁面: 685 (CN2011-ZH PDF)
配用: MCP2140DM-TMPSNS-ND - BOARD DEMO FOR MCP2140
MCP2140
DS21790A-page 44
Preliminary
2003 Microchip Technology Inc.
20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
10
5
0
10
5
0
β
Mold Draft Angle Bottom
10
5
0
10
5
0
α
Mold Draft Angle Top
0.38
0.32
0.25
.015
.013
.010
B
Lead Width
203.20
101.60
0.00
8
4
0
φ
Foot Angle
0.25
0.18
0.10
.010
.007
.004
c
Lead Thickness
0.94
0.75
0.56
.037
.030
.022
L
Foot Length
7.34
7.20
7.06
.289
.284
.278
D
Overall Length
5.38
5.25
5.11
.212
.207
.201
E1
Molded Package Width
8.18
7.85
7.59
.322
.309
.299
E
Overall Width
0.25
0.15
0.05
.010
.006
.002
A1
Standoff §
1.83
1.73
1.63
.072
.068
.064
A2
Molded Package Thickness
1.98
1.85
1.73
.078
.073
.068
A
Overall Height
0.65
.026
p
Pitch
20
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
D
p
n
B
E
E1
L
c
β
φ
α
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
§ Significant Characteristic
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