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| 型號： | MCP23009-E/MG |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 22/50頁 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16QFN |
| 標(biāo)準包裝： | 120 |
| 接口： | I²C |
| 輸入/輸出數(shù)： | 8 |
| 中斷輸出： | 是 |
| 頻率 - 時鐘： | 3.4MHz |
| 電源電壓： | 1.8 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 16-QFN-EP（3x3） |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 684 (CN2011-ZH PDF) |
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2009 Microchip Technology Inc.
DS22121B-page 29
MCP23009/MCP23S09
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings ()
Ambient temperature under bias............................................................................................................ .-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.0V
Voltage on RESET with respect to VSS ..................................................................................................... -0.3V to +14V
Voltage on all other pins with respect to VSS (except VDD and GPIOA/B) ..................................... -0.6V to (VDD + 0.6V)
Voltage on GPIO Pins: ................................................................................................................................. -0.6V to 5.5V
Total power dissipation (Note 1)...........................................................................................................................700 mW
Maximum current out of VSS pin ...........................................................................................................................200 mA
Maximum current into VDD pin .............................................................................................................................. 125 mA
Input clamp current, IIK (VI < 0 or VI > VDD)
...................................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
.............................................................................................................. ±20 mA
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sunk by any Output pin (VDD = 1.8V) ..............................................................................10 mA
Note:
Power dissipation is calculated as follows:
Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
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