參數資料
| 型號： | MCP23009-E/MG |
| 廠商： | Microchip Technology |
| 文件頁數： | 48/50頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16QFN |
| 標準包裝： | 120 |
| 接口： | I²C |
| 輸入/輸出數： | 8 |
| 中斷輸出： | 是 |
| 頻率 - 時鐘： | 3.4MHz |
| 電源電壓： | 1.8 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VFQFN 裸露焊盤 |
| 供應商設備封裝： | 16-QFN-EP（3x3） |
| 包裝： | 管件 |
| 產品目錄頁面： | 684 (CN2011-ZH PDF) |
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2009 Microchip Technology Inc.
DS22121B-page 7
MCP23009/MCP23S09
1.3.3
SPI INTERFACE
The MCP23S09 operates in Mode 0,0 and Mode 1,1.
The difference between the two modes is the idle state
of the clock.
Mode 0,0: The idle state of the clock is LOW. Input data
is latched on the rising edge of the clock; output data is
driven on the falling edge of the clock.
Mode 1,1: The idle state of the clock is HIGH. Input
data is latched on the rising edge of the clock; output
data is driven on the falling edge of the clock.
1.3.3.1
SPI Write Operation
The SPI write operation is started by lowering CS. The
write command (slave address with R/W bit cleared) is
then clocked into the device. The opcode is followed by
an address and at least one data byte.
1.3.3.2
SPI Read Operation
The SPI read operation is started by lowering CS. The
SPI read command (slave address with R/W bit set) is
then clocked into the device. The opcode is followed by
an address, with at least one data byte being clocked
out of the device.
1.3.3.3
SPI Sequential Write/Read
For sequential operations, instead of deselecting the
device by raising CS, the master clocks the next byte
pointed to by the address pointer. (see Section 1.3.1
“Byte Mode and Sequential Mode” for details
regarding sequential operation control).
The sequence ends by the raising of CS.
The MCP23S09 address pointer will roll over to
address zero after reaching the last register address.
相關PDF資料 |
PDF描述 |
|---|---|
| MCP23018-E/SO | IC I/O EXPANDER I2C 16B 28SOIC |
| MCP23018-E/SP | IC I/O EXPANDER I2C 16B 28SDIP |
| MCP23017-E/SP | IC I/O EXPANDER I2C 16B 28SDIP |
| MCP23S08-E/ML | IC I/O EXPANDER SPI 8B 20QFN |
| MCP23S09-E/SO | IC I/O EXPANDER SPI 8B 18SOIC |
相關代理商/技術參數 |
參數描述 |
|---|---|
| MCP23009EP | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8-Bit I/O Expander with Open-Drain Outputs |
| MCP23009ESO | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8-Bit I/O Expander with Open-Drain Outputs |
| MCP23009ESS | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8-Bit I/O Expander with Open-Drain Outputs |
| MCP23009T | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8-Bit I/O Expander with Open-Drain Outputs |
| MCP23009T-E/MG | 功能描述:接口 - 專用 8B I/O Expander SPI interface RoHS:否 制造商:Texas Instruments 產品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:BGA-59 |
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