參數(shù)資料
型號(hào): MCP23016-I/SP
廠商: Microchip Technology
文件頁(yè)數(shù): 21/38頁(yè)
文件大?。?/td> 0K
描述: IC I/O EXPANDER I2C 16B 28SDIP
標(biāo)準(zhǔn)包裝: 15
接口: I²C
輸入/輸出數(shù): 16
中斷輸出:
頻率 - 時(shí)鐘: 400kHz
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 通孔
封裝/外殼: 28-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 28-DIP
包裝: 管件
包括: POR
產(chǎn)品目錄頁(yè)面: 684 (CN2011-ZH PDF)
MCP23016
DS20090C-page 28
2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
.100 BSC
Top to Seating Plane
A
.200
Molded Package Thickness
A2
.120
.135
.150
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
.310
.335
Molded Package Width
E1
.240
.285
.295
Overall Length
D
1.345
1.365
1.400
Tip to Seating Plane
L
.110
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.050
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
.430
NOTE 1
N
12
D
E1
eB
c
E
L
A2
e
b
b1
A1
A
3
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