參數(shù)資料
型號(hào): MCP6H01T-E/LT
廠商: Microchip Technology
文件頁數(shù): 7/46頁
文件大?。?/td> 0K
描述: IC OP AMP 16V 1.2MHZ SGL SC-70-5
標(biāo)準(zhǔn)包裝: 3,000
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.8 V/µs
增益帶寬積: 1.2MHz
電流 - 輸入偏壓: 10pA
電壓 - 輸入偏移: 700µV
電流 - 電源: 135µA
電流 - 輸出 / 通道: 50mA
電壓 - 電源,單路/雙路(±): 3.5 V ~ 16 V,±1.75 V ~ 8 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
供應(yīng)商設(shè)備封裝: SC-70-5
包裝: 帶卷 (TR)
其它名稱: MCP6H01T-E/LTTR
2010-2011 Microchip Technology Inc.
DS22243D-page 15
MCP6H01/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
Analog Inputs
The
non-inverting
and
inverting
inputs
are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 3.5V to 16V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts can be used in single-supply
operation or dual-supply operation. Also, VDD will need
bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
MCP6H01
MCP6H02
MCP6H04
Symbol
Description
SC70-5,
SOT-23-5
SOIC
2x3 TDFNSOIC2x3 TDFN
SOIC,
TSSOP
166
1
VOUT, VOUTA Analog Output (op amp A)
422
2
VIN–, VINA
Inverting Input (op amp A)
333
3
VIN+, VINA+
Non-inverting Input (op amp A)
577
8
4
VDD
Positive Power Supply
——
5
VINB+
Non-inverting Input (op amp B)
——
6
VINB
Inverting Input (op amp B)
——
7
VOUTB
Analog Output (op amp B)
———
8
VOUTC
Analog Output (op amp C)
———
9
VINC
Inverting Input (op amp C)
———
10
VINC+
Non-inverting Input (op amp C)
244
4
11
VSS
Negative Power Supply
———
12
VIND+
Non-inverting Input (op amp D)
———
13
VIND
Inverting Input (op amp D)
———
14
VOUTD
Analog Output (op amp D)
1, 5, 8
NC
No Internal Connection
9
9
EP
Exposed Thermal Pad (EP); must
be connected to VSS.
相關(guān)PDF資料
PDF描述
LT1127CSW#TR IC OPAMP QUAD PREC HS LN 16SOIC
77313-124-44LF BERGSTIK
77317-804-26LF CONN HEADER .100 2ROW R/A 26POS
170M6271 FUSE 2000A 550V 3KN/110 AR UR
N3793-6602RB CONN HEADER 10POS STR GOLD T/H
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCP6H02-E/SN 功能描述:運(yùn)算放大器 - 運(yùn)放 1 MHz 16V Dual Gen Purpose Op amp SOIC RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP6H02-E/SN 制造商:Microchip Technology Inc 功能描述:; Op Amp Type:Unity Gain Stable; No. of 制造商:Microchip Technology Inc 功能描述:IC, OP-AMP, 1.2MHz, 0.8V/ us, 3.5mV, SOIC-8
MCP6H02T-E/MNY 功能描述:運(yùn)算放大器 - 運(yùn)放 1 MHz 16V Dual Gen Purpose Op amp TDFN RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP6H02T-E/MNY 制造商:Microchip Technology Inc 功能描述:; Op Amp Type:Unity Gain Stable; No. of 制造商:Microchip Technology Inc 功能描述:IC, OP-AMP, 1.2MHz, 0.8V/ us, 3.5mV, TDFN-8
MCP6H02T-E/SN 功能描述:運(yùn)算放大器 - 運(yùn)放 1 MHz 16V Dual Gen Purpose Op amp SOIC RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel