- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385575 > MCRF202 (Microchip Technology Inc.) 125 kHz Passive RFID Device with Sensor Input PDF資料下載
參數(shù)資料
| 型號(hào)： | MCRF202 |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 125 kHz Passive RFID Device with Sensor Input |
| 中文描述： | 的125 kHz無(wú)源RFID器件，傳感器輸入 |
| 文件頁(yè)數(shù)： | 10/20頁(yè) |
| 文件大?。?/td> | 340K |
| 代理商： | MCRF202 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)當(dāng)前第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)
MCRF202
DS21308E-page 10
2003 Microchip Technology Inc.
TABLE 3-3:
DIE MECHANICAL DIMENSIONS
TABLE 3-4:
WAFER MECHANICAL SPECIFICATIONS
Specifications
Min
Typ
Max
Unit
Comments
Bond pad opening
—
—
—
—
—
—
—
—
—
3.5 x 3.5
89 x 89
7
177.8
11
279.4
—
—
0.9050
—
—
—
—
—
—
±1
mil
μ
m
mil
μ
m
mil
μ
m
mil
μ
m
μ
m
Note 1
,
Note 2
Die backgrind thickness
Sawed 6” wafer on frame
(option = WF)
Note 3
Unsawed wafer
(option = W)
Note 3
Die backgrind thickness tolerance
±25.4
—
Die passivation thickness (multilayer)
Die Size:
Die size X*Y before saw (step size)
Die size X*Y after saw
Note 1:
The bond pad size is that of the passivation opening. The metal overlaps the bond pad passivation by at
least 0.1 mil.
2:
Metal Pad Composition is 98.5% Aluminum with 1% Si and 0.5% Cu.
3:
As the die thickness decreases, susceptibility to cracking increases. It is recommended that the die be as
thick as the application will allow.
4:
The Die Passivation thickness can vary by device depending on the mask set used:
- Layer 1: Oxide (undopped oxide 0.135
μ
m)
- Layer 2: PSG (dopped oxide, 0.43
μ
m)
- Layer 3: Oxynitride (top layer, 0.34
μ
m)
5:
The conversion rate is 25.4
μ
m/mil.
Note 4
—
—
44.15 x 68.44
42.58 x 66.87
—
—
mil
mil
—
—
Notice:
Extreme care is urged in the handling and assembly of die products since they are susceptible to
mechanical and electrostatic damage.
Specifications
Min
Typ
Max
Unit
Comments
Wafer Diameter
Die separation line width
Dice per wafer
Batch size
—
—
—
—
8
—
—
—
—
inch
μ
m
die
wafer
150 mm
80
14,000
24
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MCRF355 | CONNECTEUR |
| MCRF360 | CONNECTOR |
| MCT62H | Dual Channel Optocoupler with Phototransistor |
| MDC3105 | Integrated Relay, Inductive Load Driver(電感負(fù)載/延遲驅(qū)動(dòng)器) |
| MDF27A-1822P | Crimping Contact Directly Mounted on Board |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCRF202-I/P | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
| MCRF202-I/S | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
| MCRF202-I/SB | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
| MCRF202-I/SN | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
| MCRF202-I/W | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。