- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385575 > MCRF202 (Microchip Technology Inc.) 125 kHz Passive RFID Device with Sensor Input PDF資料下載
參數(shù)資料
| 型號： | MCRF202 |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 125 kHz Passive RFID Device with Sensor Input |
| 中文描述： | 的125 kHz無源RFID器件，傳感器輸入 |
| 文件頁數(shù)： | 11/20頁 |
| 文件大?。?/td> | 340K |
| 代理商： | MCRF202 |
2003 Microchip Technology Inc.
DS21308E-page 11
MCRF202
4.0
FAILED DIE IDENTIFICATION
Every die on the wafer is electrically tested according
to the data sheet specifications and visually inspected
to detect any mechanical damage such as mechanical
cracks and scratches.
Any failed die in the test or visual inspection is identified
by black colored inking. Therefore, any die covered
with black ink should not be used.
The ink dot specification:
Ink dot size: minimum 20
μ
m x 20
μ
m
Position: central third of die
Color: black
5.0
WAFER DELIVERY
DOCUMENTATION
Each wafer container is marked with the following
information:
Microchip Technology Inc. MP Code
Lot Number
Total number of wafer in the container
Total number of good dice in the container
Average die per wafer (DPW)
Scribe number of wafer with number of good dice.
6.0
NOTICE ON DIE AND WAFER
HANDLING
The device is very susceptible to Electrostatic
Discharge (ESD). ESD can cause critical damage to
the device. Special attention is needed during the
handling process.
Any ultraviolet (UV) light can erase the memory cell
contents of an unpackaged device. Fluorescent lights
and sun light can also erase the memory cell although
it takes more time than UV lamps. Therefore, keep any
unpackaged devices out of UV light and also avoid
direct exposure from strong fluorescent lights and sun
light.
Certain integrated circuit (IC) manufacturing, chip-on-
board (COB) and tag assembly operations may use UV
light. Operations such as backgrind, de-tape, certain
cleaning operations, epoxy or glue cure should be done
without exposing the die surface to UV light.
Using x-ray for die inspection will not harm the die, nor
erase memory cell contents.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MCRF355 | CONNECTEUR |
| MCRF360 | CONNECTOR |
| MCT62H | Dual Channel Optocoupler with Phototransistor |
| MDC3105 | Integrated Relay, Inductive Load Driver(電感負(fù)載/延遲驅(qū)動(dòng)器) |
| MDF27A-1822P | Crimping Contact Directly Mounted on Board |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCRF202-I/P | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
| MCRF202-I/S | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
| MCRF202-I/SB | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
| MCRF202-I/SN | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
| MCRF202-I/W | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:125 kHz Passive RFID Device with Sensor Input |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。