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參數(shù)資料
| 型號(hào)： | MCZ33887EK |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | 5.0 A H-Bridge with Load Current Feedback |
| 中文描述： | 5.0的H -橋的負(fù)載電流反饋 |
| 文件頁數(shù)： | 33/37頁 |
| 文件大?。?/td> | 524K |
| 代理商： | MCZ33887EK |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
33
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33887 technical
data sheet. The addendum provides thermal performance information that may
be critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
The MC33887 is offered in a 20 pin HSOP exposed pad, single die package.
There is a single heat source (P), a single junction temperature (T
J
), and thermal
resistance (R
θ
JA
).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
NOTES:
1.Per JEDEC JESD51-2 at natural convection, still air condition.
2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7.
3.Per JEDEC JESD51-8, with the board temperature on the center
trace near the center lead.
4.Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.Thermal resistance between the die junction and the exposed
pad surface; cold plate attached to the package bottom side,
remaining surfaces insulated
Figure 25. Thermal Land Pattern for Direct Thermal
Attachment According to JESD51-5
20-PIN
HSOP-EP
33887DH
Note
For package dimensions, refer to
the 33887 device data sheet.
DH SUFFIX
98ASH70273A
20-PIN HSOP-EP
T
J
=
R
θ
JA
.
P
Table 7.
Thermal Performance Comparison
Thermal Resistance
[
°
C/W]
R
θ
JA
(1)
,
(2)
20
R
θ
JB
(2)
,
(3)
6.0
R
θ
JA
(1)
,
(4)
52
R
θ
JC
(5)
1.0
1.0
1.0
0.2
0.2
Soldermast
openings
Thermal vias
connected to top
buried plane
* All measurements
are in millimeters
20 Terminal HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
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| MCZ33887EKR2 | 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 H-BRIDGE W/LD CUR FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| MCZ33887EKR2DH | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:5.0 A H-Bridge with Load Current Feedback |
| MCZ33889BEG | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC-LITE-LS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MCZ33889BEG | 制造商:Freescale Semiconductor 功能描述:IC SYSTEM BASIS W/CAN TRANCEIVER |
| MCZ33889BEG/R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:System Basis Chip with Low Speed Fault Tolerant CAN Interface |
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