參數(shù)資料
型號(hào): MCZ33887EK
廠(chǎng)商: 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述: 5.0 A H-Bridge with Load Current Feedback
中文描述: 5.0的H -橋的負(fù)載電流反饋
文件頁(yè)數(shù): 34/37頁(yè)
文件大小: 524K
代理商: MCZ33887EK
Analog Integrated Circuit Device Data
Freescale Semiconductor
34
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 26. Thermal Test Board
Device on Thermal Test Board
R
θ
JA
is the thermal resistance between die junction and
ambient air.
R
θ
JS
is the thermal resistance between die junction and the
reference location on the board surface near a center lead of the
package (see
Figure 26
).
EN
IN2
D1
C
CP
V+
OUT2
OUT2
D2
PGND
PGND
AGND
FS
IN1
V+
V+
OUT1
OUT1
FB
PGND
PGND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Tab
Tab
33887 Pin Connections
20-Pin HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
A
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area
A
:
Cu heat spreading areas on board
surface
Ambient Conditions:
Natural convection, still air
Table 8.
Thermal Resistance Performance
Thermal Resistance
Area A (mm
2
)
°
C/W
R
θ
JA
0.0
52
300
36
600
32
R
θ
JS
0.0
10
300
7.0
600
6.0
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