![](http://datasheet.mmic.net.cn/370000/MD900_datasheet_16721429/MD900_7.png)
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LCCC
CDIP
CFP
LCCC
CDIP
CDIP
CDIP
SOIC
Package
Drawing
FK
J
W
FK
J
J
J
D
Pins Package
Qty
1
1
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
84000012A
8400001EA
8400001FA
JM38510/37102B2A
JM38510/37102BEA
SN54ALS109AJ
SN54AS109AJ
SN74ALS109AD
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
20
16
16
20
16
16
16
16
None
None
None
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
None
None
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CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
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Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
1
1
1
1
40
SN74ALS109ADR
ACTIVE
SOIC
D
16
2500
CU NIPDAU
SN74ALS109AN
ACTIVE
PDIP
N
16
25
CU NIPDAU
SN74ALS109AN3
SN74ALS109ANSR
OBSOLETE
ACTIVE
PDIP
SO
N
NS
16
16
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Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
2000
SN74AS109AD
ACTIVE
SOIC
D
16
40
CU NIPDAU
SN74AS109ADR
ACTIVE
SOIC
D
16
2500
CU NIPDAU
SN74AS109AN
ACTIVE
PDIP
N
16
25
CU NIPDAU
SN74AS109ANSR
ACTIVE
SO
NS
16
2000
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
SNJ54ALS109AFK
SNJ54ALS109AJ
SNJ54AS109AFK
SNJ54AS109AJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
LCCC
CDIP
FK
J
FK
J
20
16
20
16
1
1
1
1
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(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
Not yet available Lead (Pb-Free).
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
The information provided on this page represents TI's knowledge and belief as of the date that it is