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參數(shù)資料
| 型號： | MDS35-800 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | DIODE / SCR MODULE |
| 中文描述： | 二極管/可控硅模塊 |
| 文件頁數(shù)： | 7/7頁 |
| 文件大小： | 399K |
| 代理商： | MDS35-800 |
MDS35 / 50 / 80 Series
7/7
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
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PACKAGE MECHANICAL DATA
ISOTOP
I
Recommended torque value: 1.3 Nm (max. 1.5 Nm) for the 6 x M4 screws (2 x M4 screws recom-
mended for mounting the package on the heatsink and the 4 provided screws.
I
The screws supplied with the package are adapted for mounting on a board (or other types of termi-
nals) with a thickness of 0.6 mm min. and 2.2 mm max.
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
B
C
C2
D
D1
E
E1
E2
G
G1
G2
F
F1
P
P1
S
11.80
8.90
7.8
0.75
1.95
37.80
31.50
25.15
23.85
12.20
9.10
8.20
0.85
2.05
38.20
31.70
25.50
24.15
0.465
0.350
0.307
0.030
0.077
1.488
1.240
0.990
0.939
0.480
0.358
0.323
0.033
0.081
1.504
1.248
1.004
0.951
24.80 typ.
14.90
12.60
3.50
4.10
4.60
4.00
4.00
30.10
0.976 typ.
0.587
0.496
0.138
0.161
0.181
0.157
0.157
1.185
15.10
12.80
4.30
4.30
5.00
4.30
4.40
30.30
0.594
0.504
0.169
0.169
0.197
0.69
0.173
1.193
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