參數資料
型號: MF1S5030DA8
廠商: NXP Semiconductors N.V.
元件分類: 外設及接口
英文描述: MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
封裝: MF1S5030DA3<SOT500|<<<1<Always Pb-free,;MF1S5030DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S5030DA6<SOT500-3 (PLLMC)|&
文件頁數: 29/37頁
文件大?。?/td> 425K
代理商: MF1S5030DA8
MF1S503x
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.1 — 21 February 2011
194031
29 of 37
NXP Semiconductors
MF1S503x
MIFARE Classic 1K - Mainstream contactless smart card IC
15. Bare die outline
Fig 22. Bare die outline and chip orientation MF1S5035
001aan012
VSS
LA
TESTIO
LB
Chip Step
Pad size
LA, LB, VSS
TESTIO
90
75
90
90
x (
μ
m)
y (
μ
m)
LA, LB, VSS
TESTIO
104
89
104
104
1062
(1)
1012
(1)
Y
X
typ. 27.0
(1)
min. 5.0
793.7
196.8
166.5
401.3
149.1
861.5
typ. 1062.0
(1)
typ.
1012.0
(1)
799.4
typ. 27.0
(1)
min. 5.0
Note
1. The air gap and thus the step size may vary due to varying foil expansion
2. All dimensions in
μ
m, pad locations measured from outher sealring edge (see detail)
(2)
MF1S5035
Bump size
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相關代理商/技術參數
參數描述
MF1S5030DA8,118 功能描述:RFID應答器 1KB 16bit 106Kbps RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1S5030XDA4 制造商:NXP Semiconductors 功能描述:Cut Tape
MF1S5030XDA4,118 功能描述:RFID應答器 1KB 16bit 106Kbps RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1S5030XDA4/V1J 功能描述:RFID Transponder IC 13.56MHz ISO 14443, MIFARE UART MOA4, Smart Card Module 制造商:nxp semiconductors 系列:MIFARE? 包裝:* 零件狀態(tài):有效 類型:RFID 應答器 頻率:13.56MHz 標準:ISO 14443,MIFARE 接口:UART 電壓 - 電源:- 工作溫度:-25°C ~ 70°C 封裝/外殼:MOA4,智能卡模塊 供應商器件封裝:* 標準包裝:1
MF1S5031XDUD,005 功能描述:MIFARE CLASSIC 1K SMART CARD IC RoHS:是 類別:未定義的類別 >> 其它 系列:* 標準包裝:1 系列:* 其它名稱:MS305720A