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參數(shù)資料
| 型號： | MF1S7035DUB |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 外設及接口 |
| 英文描述： | MIFARE Classic 4K - Mainstream contactless smart card IC for fast and easy solution development |
| 封裝： | MF1S7035DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S7035DUB<Uncased die|<<<1<Always Pb-free,;MF1S7035DUC<Uncased die|< |
| 文件頁數(shù)： | 24/35頁 |
| 文件大?。?/td> | 623K |
| 代理商： | MF1S7035DUB |
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MF1S703x
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.0 — 2 December 2010
199330
24 of 35
NXP Semiconductors
MF1S703x
MIFARE Classic 4K - Mainstream contactless smart card IC
13. Wafer specification
Table 24.
Wafer
diameter
thickness
flatness
Potential Good Dies per Wafer (PGDW)
Wafer backside
material
treatment
roughness
[1]
the gap between chips may vary due to changing foil expansion
Table 25.
Bond pads (substrate connected to VSS)
size (metallization)
[1]
Pads VSS and TESTIO are disconnected when wafer is sawn.
Table 26.
Au bump (substrate connected to VSS)
material
hardness
shear strength
height
Wafer specifications MF1S7035DUx
200 mm typical (8 inches)
150
m
15
m
not applicable
15601
Si
ground and stress relieve
R
a
max = 0.5
m
R
t
max = 5
m
Chip dimensions
step size
x = 1420
m
y = 1340
m
x = 86,4
m
y = 86,4
m
scribe line
Passivation
type
material
thickness
sandwich structure
PSG / nitride
500 nm / 600 nm
Bond pad specifications
LA, LB = 118
m
118
m
VSS
[1]
= 108
m
108
m
TESTIO
[1]
= 95
m
110
m
LA, LB = 90
m
90
m
VSS
[1]
= 80
m
80
m
TESTIO
[1]
= 67
m
82
m
Al-Cu
850 nm
size (pad opening)
material
thickness
Bump specifications
>
99.9 % pure Au
35 to 80 HV 0.005
> 70 MPa
18
m
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相關代理商/技術參數(shù) |
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| MF1S7035DUB,005 | 功能描述:RFID應答器 MIFARE CLASSIC 4K CONTACTLESS SMART IC RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
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| MF1SPLUS6001DA4/02 | 功能描述:RFID應答器 MIFARE PLUS S 2K SMART CARD RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1SPLUS6001DA4/03 | 功能描述:RFID應答器 MIFARE CRYPTO1 AES 848Kbps 2KB RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1SPLUS6001DA403 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development |
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