參數(shù)資料
型號(hào)： MF1S7035DUB
廠商： NXP Semiconductors N.V.
元件分類： 外設(shè)及接口
英文描述： MIFARE Classic 4K - Mainstream contactless smart card IC for fast and easy solution development
封裝： MF1S7035DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S7035DUB<Uncased die|<<<1<Always Pb-free,;MF1S7035DUC<Uncased die|<
文件頁數(shù)： 25/35頁
文件大?。?/td> 623K
代理商： MF1S7035DUB
MF1S703x
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.0 — 2 December 2010
199330
25 of 35
NXP Semiconductors
MF1S703x
MIFARE Classic 4K - Mainstream contactless smart card IC
[1]
Pads VSS and TESTIO are disconnected when wafer is sawn.
13.1 Fail die identification
All fail dies are inked according to electrical test results.
Electronic wafer mapping covers the electrical test results and additionally the results of
mechanical/visual inspection.
height uniformity
within a die =
2
m
within a wafer =
3
m
wafer to wafer =
4
m
minimum =
1.5
m
LA, LB = 104
m
104
m
VSS
[1]
= 94
m
94
m
TESTIO
[1]
= 81
m
96
m
5
m
sputtered TiW
flatness
size
size variation
under bump metallization
Table 26.
Bump specifications
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MF1S7035DUB,005 功能描述:RFID應(yīng)答器 MIFARE CLASSIC 4K CONTACTLESS SMART IC RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1S7035DUC,005 功能描述:RFID應(yīng)答器 MIFARE CLASSIC 4K CONTACTLESS SMART IC RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1SPLUS6001DA4/02 功能描述:RFID應(yīng)答器 MIFARE PLUS S 2K SMART CARD RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1SPLUS6001DA4/03 功能描述:RFID應(yīng)答器 MIFARE CRYPTO1 AES 848Kbps 2KB RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1SPLUS6001DA403 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development
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