參數(shù)資料
型號: MF1S7035DUC
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: MIFARE Classic 4K - Mainstream contactless smart card IC for fast and easy solution development
封裝: MF1S7035DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S7035DUB<Uncased die|<<<1<Always Pb-free,;MF1S7035DUC<Uncased die|<
文件頁數(shù): 29/35頁
文件大小: 623K
代理商: MF1S7035DUC
MF1S703x
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.0 — 2 December 2010
199330
29 of 35
NXP Semiconductors
MF1S703x
MIFARE Classic 4K - Mainstream contactless smart card IC
15. Bare die outline
Fig 21. Bare die outline and chip orientation MF1S7035
001aan020
VSS
LA
TESTIO
Chip Step
Pad size
LA, LB
VSS
TESTIO
90
80
67
90
80
82
x (
μ
m)
y (
μ
m)
LA, LB
VSS
TESTIO
104
94
81
104
94
96
1420
1340
86.4
81.4
Y
X
86.4
1172.8
81.9
87.6
76.0
310.8
1248.4
1420.0
1340.0
1167.8
LB
MF1S7035
Note
1. All dimensions in
μ
m, pad locations measured from outher sealring edge (see detail)
(1)
Bump size
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MF1S7035DUC,005 功能描述:RFID應(yīng)答器 MIFARE CLASSIC 4K CONTACTLESS SMART IC RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1SPLUS6001DA4/02 功能描述:RFID應(yīng)答器 MIFARE PLUS S 2K SMART CARD RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1SPLUS6001DA4/03 功能描述:RFID應(yīng)答器 MIFARE CRYPTO1 AES 848Kbps 2KB RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1SPLUS6001DA403 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development
MF1SPLUS6001DUD/02 功能描述:RFID應(yīng)答器 MIFARE PLUS S 2K SMART CARD RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel