參數(shù)資料
型號: MF1S7035DUC
廠商: NXP Semiconductors N.V.
元件分類: 外設及接口
英文描述: MIFARE Classic 4K - Mainstream contactless smart card IC for fast and easy solution development
封裝: MF1S7035DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S7035DUB<Uncased die|<<<1<Always Pb-free,;MF1S7035DUC<Uncased die|<
文件頁數(shù): 35/35頁
文件大?。?/td> 623K
代理商: MF1S7035DUC
NXP Semiconductors
MF1S703x
MIFARE Classic 4K - Mainstream contactless smart card IC
NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 December 2010
199330
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
23. Contents
1
1.1
1.2
1.3
1.4
2
2.1
3
4
5
6
7
7.1
8
8.1
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.3
8.4
8.5
8.6
8.6.1
8.6.2
8.6.2.1
8.6.3
8.7
8.7.1
8.7.2
8.7.3
9
9.1
9.2
9.3
9.4
10
10.1
10.2
10.3
10.4
10.5
11
General description. . . . . . . . . . . . . . . . . . . . . . 1
Anti-collision . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Simple integration and user convenience. . . . . 1
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Delivery options . . . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Block description . . . . . . . . . . . . . . . . . . . . . . . 5
Communication principle . . . . . . . . . . . . . . . . . 5
Request standard/all. . . . . . . . . . . . . . . . . . . . . 5
Anti-collision loop . . . . . . . . . . . . . . . . . . . . . . . 5
Select card . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Three pass authentication . . . . . . . . . . . . . . . . 6
Memory operations. . . . . . . . . . . . . . . . . . . . . . 7
Data integrity. . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Three pass authentication sequence . . . . . . . . 7
RF interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Memory organization . . . . . . . . . . . . . . . . . . . . 9
Manufacturer block. . . . . . . . . . . . . . . . . . . . . 10
Data blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Value blocks . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Sector trailer . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Memory access . . . . . . . . . . . . . . . . . . . . . . . 12
Access conditions. . . . . . . . . . . . . . . . . . . . . . 12
Access conditions for the sector trailer. . . . . . 13
Access conditions for data blocks. . . . . . . . . . 14
Command overview. . . . . . . . . . . . . . . . . . . . . 15
MIFARE Classic command overview . . . . . . . 15
Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
MIFARE Classic ACK and NAK . . . . . . . . . . . 16
ATQA and SAK responses . . . . . . . . . . . . . . . 16
MIFARE Classic commands . . . . . . . . . . . . . . 17
MIFARE Authentication . . . . . . . . . . . . . . . . . 17
MIFARE Read. . . . . . . . . . . . . . . . . . . . . . . . . 18
MIFARE Write. . . . . . . . . . . . . . . . . . . . . . . . . 19
MIFARE Increment, Decrement and Restore. 20
MIFARE Transfer . . . . . . . . . . . . . . . . . . . . . . 22
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 23
12
13
13.1
14
15
16
17
18
19
19.1
19.2
19.3
19.4
20
21
22
23
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23
Wafer specification . . . . . . . . . . . . . . . . . . . . . 24
Fail die identification . . . . . . . . . . . . . . . . . . . 25
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 26
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 29
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 30
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Revision history . . . . . . . . . . . . . . . . . . . . . . . 31
Legal information . . . . . . . . . . . . . . . . . . . . . . 32
Data sheet status. . . . . . . . . . . . . . . . . . . . . . 32
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Contact information . . . . . . . . . . . . . . . . . . . . 33
Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
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