參數(shù)資料
型號: MF3ICD8101DUD
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: MIFARE DESFire EV1 contactless multi-application IC
文件頁數(shù): 3/18頁
文件大?。?/td> 126K
代理商: MF3ICD8101DUD
MF3ICDX21_41_81_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 21 December 2010
145631
3 of 18
NXP Semiconductors
MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
1 card master key and up to 14 keys per application
Hardware DES using 56/112/168 bit keys featuring key version, data authenticity by
8 byte CMAC
Hardware AES using 128-bit keys featuring key version, data authenticity by 8 byte
CMAC
Data encryption on RF-channel
Authentication on application level
Hardware exception sensors
Self-securing file system
Backward compatibility to MF3ICD40: 4 byte MAC, CRC 16
2.6 Special features
Transaction oriented automatic anti-tear mechanism
Configurable ATS information for card personalisation
Backward compatibility mode to MF3ICD40
Optional high input capacitance (70pF) for small form factor design (MF3ICDH
21/41/81)
3. Applications
Advanced public transportation schema
Highly secure access management
Closed-loop e-payment scheme
Event ticketing
eGovernment applications
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MF3ICD8101DUD/01,005 制造商:NXP Semiconductors 功能描述:
MF3ICD8101DUD/03,005 制造商:NXP Semiconductors 功能描述:
MF3ICD8101DUD/04 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:MIFARE DESFire EV1 contactless multi-application IC
MF3ICD8101DUD/04,0 功能描述:RFID應(yīng)答器 MIFARE DESFire EV1 ContactlessMultiAppl RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF3ICD8101DUD/05,0 功能描述:RFID應(yīng)答器 MIFARE DESFIRE EV1 CONTACTLESS MULTIAPP RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel