參數(shù)資料
型號(hào): MF3ICD8101DUD
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: MIFARE DESFire EV1 contactless multi-application IC
文件頁(yè)數(shù): 7/18頁(yè)
文件大小: 126K
代理商: MF3ICD8101DUD
MF3ICDX21_41_81_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 21 December 2010
145631
7 of 18
NXP Semiconductors
MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
8. Functional description
8.1 Contactless energy and data transfer
In the MIFARE system, the MIFARE DESFire EV1 is connected to a coil consisting of a
few turns embedded in a standard ISO/IEC smart card (see
Ref. 8
). A battery is not
needed. When the card is positioned in the proximity of the PCD antenna, the high speed
RF communication interface allows data to be transmitted up to 848 kbit/s.
8.2 Anti-collision
An intelligent anti-collision mechanism allows more than one MIFARE DESFire EV1 in the
field to be handled simultaneously. The anti-collision algorithm selects each MIFARE
DESFire EV1 individually and ensures that the execution of a transaction with a selected
MIFARE DESFire EV1 is performed correctly without data corruption resulting from other
MIFARE DESFire EV1s in the field.
8.3 UID/serial number
The unique 7 byte (UID) is programmed into a locked part of the NV memory which is
reserved for the manufacturer. Due to security and system requirements these bytes are
write-protected after being programmed by the IC manufacturer at production time.
According to ISO/IEC 14443-3 (see
Ref. 12
) during the first anti-collision loop the cascade
tag returns a value of 88h and also the first 3 bytes of the UID, UID0 to UID2 and BCC.
The second anti-collision loop returns bytes UID3 to UID6 and BCC.
UID0 holds the manufacturer ID for NXP (04h) according to ISO/IEC 14443-3 and
ISO/IEC 7816-6 AMD 1.
MIFARE DESFire EV1 also allows Random ID to be used. In this case MIFARE DESFire
EV1 only uses a single anti-collision loop. The 3 byte random number is generated after
RF reset of the MIFARE DESFire EV1.
8.4 Memory organization
The 2/4/8 KB NV memory is organized using a flexible file system. This file system allows
a maximum of 28 different applications on one MIFARE DESFire EV1. Each application
provides up to 32 files. Every application is represented by its 3 bytes Application
IDentifier (AID).
Five different file types are supported; see
Section 8.5
.
A guideline to assign MIFARE DESFire AIDs can be found in the application note
MIFARE
Application Directory
(MAD); see
Ref. 9
.
Each file can be created either at MIFARE DESFire EV1 initialization (card
production/card printing), at MIFARE DESFire EV1 personalization (vending machine) or
in the field.
If a file or application becomes obsolete in operation, it can be permanently invalidated.
Commands which have impact on the file structure itself (e.g. creation or deletion of
applications, change of keys) activate an automatic rollback mechanism, which protects
the file structure from being corrupted.
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MF3ICD8101DUD/01,005 制造商:NXP Semiconductors 功能描述:
MF3ICD8101DUD/03,005 制造商:NXP Semiconductors 功能描述:
MF3ICD8101DUD/04 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:MIFARE DESFire EV1 contactless multi-application IC
MF3ICD8101DUD/04,0 功能描述:RFID應(yīng)答器 MIFARE DESFire EV1 ContactlessMultiAppl RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF3ICD8101DUD/05,0 功能描述:RFID應(yīng)答器 MIFARE DESFIRE EV1 CONTACTLESS MULTIAPP RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel