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參數(shù)資料
| 型號： | MF3MOD2101DA4 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 外設及接口 |
| 英文描述： | MIFARE DESFire EV1 contactless multi-application IC |
| 文件頁數(shù)： | 14/18頁 |
| 文件大?。?/td> | 126K |
| 代理商： | MF3MOD2101DA4 |
MF3ICDX21_41_81_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 21 December 2010
145631
14 of 18
NXP Semiconductors
MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
11. References
[1]
[2]
Data sheet —
MF3ICD81 MIFARE DESFire EV1
, document number: 13403**
1
.
Data sheet —
MF3ICD81 Guidance, Delivery and Operation Manual
, document
number: 1469**.
Data sheet —
Specification addendum MF3ICD81
, document number: 1673**.
Data sheet —
MF3ICD8101 Sawn bumped 120
m wafer addendum
, document
number: 1318**.
Data sheet —
MF3ICDH8101 Sawn bumped 120
m wafer addendum
, document
number: 1970**.
Data sheet —
MF3MODx21_41_81 Contactless chip card module
, document
number: 1439**.
Application note —
MIFARE DESFire - Implementation hints and examples
,
document number: 0945**.
Application note —
Card Coil Design Notes for MIFARE DESFire EV1
, document
number: 1713**.
Application note —
MIFARE Application Directory
, document number: 0018**.
[10] Application note —
MIFARE ISO/IEC 14443 PICC Selection
, document number:
1308**.
[11] Application note —
End to end system security risk considerations for
implementing contactless cards
, document number: 1550**.
[12] ISO/IEC Standard —
ISO/IEC 14443 Identification cards - Contactless integrated
circuit cards - Proximity cards
.
[3]
[4]
[5]
[6]
[7]
[8]
[9]
1.
** ... BU-ID document version number
相關PDF資料 |
PDF描述 |
|---|---|
| MF3MOD4101DA4 | MIFARE DESFire EV1 contactless multi-application IC |
| MF3MOD8101DA4 | MIFARE DESFire EV1 contactless multi-application IC |
| MF3MODH2101DA4 | MIFARE DESFire EV1 contactless multi-application IC |
| MF3MODH4101DA4 | MIFARE DESFire EV1 contactless multi-application IC |
| MF3MODH8101DA4 | MIFARE DESFire EV1 contactless multi-application IC |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MF3MOD2101DA4/01,118 | 制造商:NXP Semiconductors 功能描述: |
| MF3MOD2101DA4/04,1 | 功能描述:RFID應答器 MIFARE DESFire EV2 ContactlessMultiAppl RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF3MOD2101DA4/05,1 | 功能描述:RFID應答器 MIFARE DESFire EV1 Contctless multi-app RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF3MOD2101DA4/051 | 制造商:NXP Semiconductors 功能描述:MIFARE DESFIRE 2K MOA4 |
| MF3MOD4001DV/406,1 | 功能描述:射頻收發(fā)器 MIFARE DESFIRE MOA4 RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
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