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參數(shù)資料
| 型號(hào)： | MHPM6B15E60D3 |
| 廠商： | MOTOROLA INC |
| 元件分類： | IGBT 晶體管 |
| 英文描述： | Hybrid Power Module |
| 中文描述： | 15 A, 600 V, N-CHANNEL IGBT |
| 文件頁(yè)數(shù)： | 4/5頁(yè) |
| 文件大?。?/td> | 129K |
| 代理商： | MHPM6B15E60D3 |
4
Motorola IGBT Device Data
RECOMMENDED PCB LAYOUT
VIEW OF BOARD FROM HEAT SINK
(All Dimensions Typical)
OPTIONAL NON–PLATED
THRU–HOLES FOR ACCESS
TO HEAT SINK MOUNTING
SCREWS (x2)
1.530
0.250
1.350
0.250
PACKAGE “SHADOW”
PLATED THRU–HOLES
(x16)
3.500
0.270
PIN 1
0.265
NON–PLATED THRU–HOLE
0.140
0.175
0.065
0.625
0.175
0.175
0.625
0.450
KEEP–OUT ZONES (x4)
0.270
Figure 2. Package Footprint
NOTE:
1. Package is symmetrical, except for a polarizing plastic post near pin 1, indicated by a non–plated thru–hole in the footprint.
2. Dimension of plated thru–holes indicates net size after plating.
3. Access holes for mounting screws may or may not be necessary depending on assembly plan for finished product.
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| MHPM6B15N120SL | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Hybrid Power Module |
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| MHPM6B20E60D3 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Hybrid Power Module |
| MHPM6B25N120SL | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Hybrid Power Module |
| MHPM6B25N120SS | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Hybrid Power Module |
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