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參數(shù)資料
| 型號： | MIP7365-450B1M |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 450 MHz, MICROPROCESSOR, PBGA256 |
| 封裝： | 26 X 26 MM, TBGA-256 |
| 文件頁數(shù)： | 3/16頁 |
| 文件大小： | 285K |
| 代理商： | MIP7365-450B1M |
11
SCD7365 Rev B 1/11/07
Aeroflex Plainview
THERMAL INFORMATION
This product is designed to operate over a wide temperature range when used with a heat sink.
Notes
1. Short-term is understood as the definition stated in Telcordia Generic Requirements GR-63-Core.
2.
θJC, the junction-to-case thermal resistance, θJB, the junction-to-board thermal resistance are obtained from Package vendor.
3.
θSA is the thermal resistance of the heat sink to ambient. θCS is the thermal resistance of the heat sink attached material.
4. The actual
θSA required may vary according to the air speed at the location of the device in the system with all the components in place.
Maximum long-term operating junction temperature to ensure adequate long-term life
TBD at 450 MHz
Maximum junction temperature for short-term excursions with guaranteed continued
functional performance
TBD at 450 MHz
Minimum ambient temperature
TBD
Device Compact Model 2
θJT (°C/W)
4.19
θJB (°C/W)
5.43
θJA (°C/W)
11.65
Operating power is dissipated in any package (watts) offered at worst case power supply
Power at 450MHz
VccInt = 1.3 V, VccIO = 3.3 V
2.8W
SA
Θ
ΘCS
Θ
ΘJT
JB
Θ
Ambient
Heat Sink
Case
Junction
Board
Device Compact
Model
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