Communications Clock PLL
MDS 2049-10 E
8
Revision 021402
Integrated Circuit Systems, Inc. q 525 Race Street San Jose, CA 95126 q tel (408) 295-9800 q
www.icst.com
MK2049-10
Recommended Crystal Parameters:
Operating Temperature Range
Commercial Applications
0 to 70
°C
Industrial Applications
-40 to 85
°C
Initial Accuracy at 25
°C
±20 ppm
Temperature Stability
±30 ppm
Aging
±20 ppm
Load Capacitance
14 pF
Shunt Capacitance, C0
7 pF Max
C0/C1 Ratio
250 Max
Equivalent Series Resistance
35
Max
Note: Crystals used in production should be screened
for 3rd overtone modes and spurs over the range of (3x
crystal frequency) +/- 100ppm, when measured at the
nominal parallel resonant frequency. Failure to do so
may cause locking problems in a small percentage of
production systems at certain input frequencies.
Crystal Tuning Load Capacitors
The crystal traces should include pads for small
capacitors from X1 and X2 to ground, shown as CL in
the Block Diagram on page 1. These capacitors are
optional and may be later used to center the total load
capacitor adjustment range imposed on the crystal.
The load adjustment range includes stray PCB
capacitance that varies with board layout. Because the
typical telecom reference frequency is accurate to less
than 32 ppm, the MK2049-10 may operate properly
without these adjustment capacitors. However, ICS
recommends that these capacitors be included to
minimize the effects of variation in individual crystals,
included those induced by temperature and aging. The
value of these capacitors (typically 0-4 pF) is
determined once for a given board layout, using the
procedure described in the section titled “Optimization
of Crystal Load Capacitors”.
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1) Each 0.01F decoupling capacitor should be
mounted on the component side of the board as close
to the VDD pin as possible. No via’s should be used
between the decoupling capacitor and VDD pin. The
PCB trace to VDD pin should be kept as short as
possible, as should the PCB trace to the ground via.
Distance of the ferrite chip and bulk decoupling from
the device is less critical.
2) The loop filter components must also be placed
close to the CAP1 and CAP2 pins. C2 should be
closest to the device. Coupling of noise from other
system signal traces should be minimized by keeping
traces short and away from active signal traces. Use of
vias should be avoided.
3) The external crystal should be mounted as close the
device as possible, on the component side of the
board. This will keep the crystal PCB traces short
which will minimize parasitic load capacitance on the
crystal, and noise pickup. The crystal traces should be
spaced away from each other and should use minimum
trace width. There should be no signal traces near the
crystal or the traces. Also refer to the Optional Crystal
Shielding section that follows.
4) To minimize EMI the 33
series termination resistor,
if needed, should be placed close to the clock output.
5) All components should be on the same side of the
board, minimizing vias through other signal layers (the
ferrite bead and bulk decoupling capacitor may be
mounted on the back). Other signal traces should be
routed away from the MK2049-10. This includes signal
traces on PCB just underneath the device, or on layers
adjacent to the ground plane layer used by the device.
6) Because each input selection pin includes an
internal pull-up device, those inputs requiring a logic
high state (“1”) can be left unconnected. The pins
requiring a logic low state (“0”) can be connected
directly to ground.