參數(shù)資料
型號: MK2069-02GITR
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: 時鐘產(chǎn)生/分配
英文描述: 160 MHz, OTHER CLOCK GENERATOR, PDSO56
封裝: 6.10 MM, 0.50 MM PITCH, TSSOP-56
文件頁數(shù): 4/21頁
文件大小: 210K
代理商: MK2069-02GITR
MK2069-02
VCXO-BASED CLOCK JITTER ATTENUATOR AND TRANSLATOR
VCXO AND SYNTHESIZER
IDT VCXO-BASED CLOCK JITTER ATTENUATOR AND TRANSLATOR
12
MK2069-02
REV G 050203
Recommended Crystal Parameters:
Crystal parameters can be found in application note MAN05
on the IDT web site. Approved crystals can be found on the
IDT web site (search “crystal”).
Crystal Tuning Load Capacitors
The crystal traces should include pads for small capacitors
from X1 and X2 to ground, shown as CL in the External
VCXO PLL Components diagram on page 6. These
capacitors are used to center the total load capacitor
adjustment range imposed on the crystal. The load
adjustment range includes stray PCB capacitance that
varies with board layout. Because the typical telecom
reference frequency is accurate to less than 32 ppm, the
MK2069-02 may operate properly without these adjustment
capacitors. However, ICS recommends that these
capacitors be included to minimize the effects of variation in
individual crystals, including those induced by temperature
and aging. The value of these capacitors (typically 0-4 pF)
is determined once for a given board layout, using the
procedure described in MAN05.
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed. Please
refer to the Recommended PCB Layout drawing on the
following page.
1) Each 0.01F decoupling capacitor (CD) should be
mounted on the component side of the board as close to the
VDD pin as possible. No via’s should be used between the
decoupling capacitor and VDD pin. The PCB trace to VDD
pin should be kept as short as possible, as should the PCB
trace to the ground via. Distance of the ferrite chip and bulk
decoupling from the device is less critical.
2) The loop filter components must also be placed close to
the LF and LFR pins. CP should be closest to the device.
Coupling of noise from other system signal traces should be
minimized by keeping traces short and away from active
signal traces. Use of vias should be avoided.
3) The external crystal should be mounted as close to the
device as possible, on the component side of the board.
This will help keep the crystal PCB traces short to minimize
parasitic load capacitance on the crystal leads as well as
noise pickup. The crystal traces should be spaced away
from each other and should use minimum trace width. There
should be no signal traces near the crystal or the traces.
Also refer to the Optional Crystal Shielding section that
follows.
4) To minimize EMI the 33
Ω series termination resistor, if
needed, should be placed close to the clock output.
5) All components should be on the same side of the board,
minimizing vias through other signal layers (the ferrite bead
and bulk decoupling capacitor may be mounted on the
back). Other signal traces should be routed away from the
MK2069-02. This includes signal traces on PCB traces just
underneath the device, or on layers adjacent to the ground
plane layer used by the device.
6) Because each input selection pin includes an internal
pull-up device, those inputs requiring a logic high state (“1”)
can be left unconnected. The pins requiring a logic low state
(“0”) can be grounded.
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