參數(shù)資料
型號: ML63512A-XXXTP
廠商: LAPIS SEMICONDUCTOR CO LTD
元件分類: 微控制器/微處理器
英文描述: 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP64
封裝: PLASTIC, TQFP-64
文件頁數(shù): 25/33頁
文件大小: 281K
代理商: ML63512A-XXXTP
Semiconductor
ML63512A/63514A
30/32
FEDL63512A-03
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
TQFP48-P-0707-0.50-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
mm or more
0.13 TYP.
Mirror finish
相關PDF資料
PDF描述
ML63512A-XXXTP 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP64
ML63512A-XXXTB 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP48
ML63514A-XXXTP 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP64
ML63514-XXXTP 4-BIT, MROM, MICROCONTROLLER, PQFP64
ML67Q5002LA 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PBGA144
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