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參數(shù)資料
| 型號(hào)： | ML63P238 |
| 廠商： | OKI SEMICONDUCTOR CO., LTD. |
| 英文描述： | 4-Bit Microcontroller with Built-in 16K Word PROM, POCSAG Decoder, and Melody Circuit(帶內(nèi)置16K字PROM，POCSAG譯碼器和音頻電路的4位微控制器) |
| 中文描述： | 4位微控制器內(nèi)置16K的Word中胎膜早破，POCSAG碼解碼器，和旋律電路（帶內(nèi)置16K的字胎膜早破，POCSAG碼譯碼器和音頻電路的4位微控制器） |
| 文件頁(yè)數(shù)： | 28/28頁(yè) |
| 文件大?。?/td> | 173K |
| 代理商： | ML63P238 |
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Semiconductor
MSM63P238
28/28
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP80-P-1420-0.80-BK
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
m
m or more
1.27 TYP.
Mirror finish
PACKAGE DIMENSIONS
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