參數(shù)資料
型號： MM908E626R2
廠商： 飛思卡爾半導體(中國)有限公司
元件分類： 基準電壓源/電流源
英文描述： Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
中文描述： 集成的步進電機驅(qū)動器，帶有嵌入式微控制器和LIN串行通信
文件頁數(shù)： 5/32頁
文件大小： 303K
代理商： MM908E626R2
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
908E626
5
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage to
the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation (Steady-State)
Analog Chip Supply Voltage under Transient Conditions
(Note 1)
Microcontroller Chip Supply Voltage
V
SUP(
SS
)
V
SUP(
PK
)
V
DD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
V
Input Terminal Voltage
Analog Chip
Microcontroller Chip
V
IN
(ANALOG)
V
IN
(MCU)
-0.3 to 5.5
V
SS
-0.3 to V
DD
+0.3
V
Maximum Microcontroller Current per Terminal
All Terminals Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Terminals PTA0:PTA6, PTC0:PTC1
I
PIN
(1)
I
PIN
(2)
±15
±25
mA
Maximum Microcontroller V
SS
Output Current
I
MVSS
100
mA
Maximum Microcontroller V
DD
Input Current
I
MVDD
100
mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions
(Note 1)
V
BUS(SS)
V
BUS(DYNAMIC)
-18 to 28
40
V
ESD Voltage
Human Body Model
(Note 2)
Machine Model
(Note 3)
Charge Device Model
(Note 4)
V
ESD1
V
ESD2
V
ESD3
±3000
±150
±500
V
THERMAL RATINGS
Storage Temperature
T
STG
-40 to 150
°
C
Operating Case Temperature
(Note 5)
T
C
-40 to
115
°
C
Operating Junction Temperature
Analog
MCU
(Note 6)
T
J(ANALOG)
T
J(MCU)
-40 to 150
-40 to 135
°
C
Peak Package Reflow Temperature During Solder Mounting
(Note 7)
T
SOLDER
245
°
C
Thermal Resistance (Junction to Ambient)
All Outputs ON
(Note 8)
,
(Note 10)
Single Output ON
(Note 9)
,
(Note 10)
R
θ
JA1
R
θ
JA2
24
27
°
C/W
Notes
1.
2.
3.
4.
5.
6.
7.
Transient capability for pulses with a time of t < 0.5 sec.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
=200 pF,
R
ZAP
=0
).
ESD3 testing is performed in accordance with Charge Device Model, robotic (C
ZAP
=4.0 pF).
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
In the 125°C to 135°C temperature range, the FLASH is guaranteed as read only.
Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
All outputs ON and dissipating equal power.
One output ON and dissipating power.
Per JEDEC JESD51-2 at natural convection, still air condition; and 2s2p thermal test board per JEDEC JESD51-7 and JESD51-5 (thermal
vias connected to top ground plane).
8.
9.
10.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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