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參數(shù)資料
| 型號(hào)： | MMBD6100-TP |
| 廠商： | MICRO COMMERCIAL COMPONENTS |
| 元件分類(lèi)： | 參考電壓二極管 |
| 英文描述： | 0.2 A, 2 ELEMENT, SILICON, SIGNAL DIODE |
| 封裝： | PLASTIC PACKAGE-3 |
| 文件頁(yè)數(shù)： | 1/3頁(yè) |
| 文件大小： | 584K |
| 代理商： | MMBD6100-TP |
MMBD6100
Monolithic Dual
Switching Diode
)HDWXUHV
Capable of 225Watts of Power Dissipation
0D[LPXP5DWLQJV
Operating Temperature: -55
OC to +150OC
Storage Temperature: -55
OC to +150OC
Maximum Thermal Resistance; 556
OC/W Junction To Ambient
(OHFWULFDO &KDUDFWHULVWLFV# & 8QOHVV 2WKHUZLVH 6SHFLILHG
Reverse Voltage
VR
70V
Minimum Reverse
Breakdown Voltage
VBR
70V
IBR=100
A
Forward Current
IF
200mA
Power Dissipation
FR-5 Board
(1)
PTOT
225mW
1.8mW/
OC
TA=25
OC
Derate above
25
OC
Power Dissipation
Alumina Substrate
(2)
PTOT
300mW
2.4mW/
OC
TA=25
OC
Derate above
25
OC
Peak Forward Surge
Current
IFSM
500mA
8.3ms, half
sine
Junction
Temperature
TJ
150
OC
Forward Voltage
VF
0.55~0.7V
0.85~1.1V
IF=1.0mA
IF=100mA
Maximum Reverse
Voltage Leakage
Current
IR
0.1
A
VR=50V
TA=25
OC,
Maximum Junction
Capacitance
CJ
2.5pF
Measured at
VR=0V
Maximum Reverse
Recovery Time
Trr
4.0nS
IF=IR=10mA
IR (RCE)=1.0mA
1) FR-5=1.0 × 0.75 × 0.062 in.
Alumina=0.4 × 0.3 × 0.024 in. 99.5& alumina.
SOT-23
Suggested Solder
Pad Layout
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
NOTE
A
.110
.120
2.80
3.04
B
.083
.098
2.10
2.64
C
.047
.055
1.20
1.40
D
.035
.041
.89
1.03
E
.070
.081
1.78
2.05
F
.018
.024
.45
.60
G
.0005
.0039
.013
.100
H
.035
.044
.89
1.12
J
.003
.007
.085
.180
K
.015
.020
.37
.51
A
B
C
D
E
F
G
H
J
.079
2.000
inches
mm
.031
.800
.035
.900
.037
.950
.037
.950
K
www.mccsemi.com
omponents
20736 Marilla Street Chatsworth
!"#
$% !"#
MCC
Revision: 4
2006/05/13
TM
Micro Commercial Components
Pin Configuration
Top View
SOT-23 Package For Surface Mount Application
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Low Leakage Current
1 of 3
Marking : 5BM
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