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參數(shù)資料
| 型號： | MPC104AU |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 多路復用及模擬開關 |
| 英文描述： | 2-CHANNEL, VIDEO MULTIPLEXER, PDSO8 |
| 封裝： | SO-8 |
| 文件頁數(shù)： | 11/16頁 |
| 文件大小： | 172K |
| 代理商： | MPC104AU |
MPC104
4
PIN
DESCRIPTION
IN1, IN2
Analog Input Channels
GND
Analog Input Shielding Grounds,
Connect to System Ground
SEL1, SEL2
Channel Selection Inputs
VOUT
Analog Output; tracks selected channel
–VCC
Negative Supply Voltage; typical –5VDC
+VCC
Positive Supply Voltage; typical +5VDC
CONNECTION DIAGRAM
PIN DESCRIPTION
Top View
DIP/SO-8
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage (
±V
CC) ......................................................... ±6VDC
Analog Input Voltage (IN1 through IN2) ................................... ±VCC, ±0.7V
Operating Temperature ..................................................... –40
°C to +85°C
Storage Temperature ...................................................... –40
°C to +125°C
Output Current ..................................................................................
±6mA
Junction Temperature .................................................................... +175
°C
Lead Temperature (soldering, 10s) ................................................ +300
°C
Digital Input Voltages (SEL1 through SEL2) .............. –0.5V to +VCC +0.7V
PACKAGE
DRAWING
TEMPERATURE
PRODUCT
PACKAGE
NUMBER(1)
RANGE
MPC104AP
8-Pin Plastic DIP
006
–40
°C to +85°C
MPC104AU
SO-8 Surface Mount
182
–40
°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE/ORDERING INFORMATION
IN
1
GND
+V
CC
IN
2
SEL
1
–V
CC
V
OUT
SEL
2
1
2
3
4
8
7
6
5
+1
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
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