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參數(shù)資料
| 型號(hào)： | MPC106ARX83TG |
| 廠商： | MOTOROLA INC |
| 元件分類(lèi)： | 總線控制器 |
| 英文描述： | PCI Bridge/Memory Controller |
| 中文描述： | PCI BUS CONTROLLER, CBGA304 |
| 封裝： | 21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304 |
| 文件頁(yè)數(shù)： | 25/28頁(yè) |
| 文件大小： | 158K |
| 代理商： | MPC106ARX83TG |
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MPC106 PCI Bridge/Memory Controller Hardware Specifications
25
System Design Information
Figure 14. Exploded Cross-Sectional View
1.8.5.1 Internal Package Conduction Resistance
For this C4/CBGA packaging technology, the intrinsic conduction thermal resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-lead thermal resistance
These parameters are shown in Table 13. In this C4/CBGA package, the silicon chip is exposed; therefore,
the package “case” is the top of the silicon.
Figure 15 provides a simplified thermal network in which a C4/CBGA package is mounted to a
printed-circuit board.
Figure 15. C4/CBGA Package Mounted to a Printed-Circuit Board
Table 13. Thermal Resistance
Thermal Metric
Effective Thermal Resistance
Junction-to-case thermal resistance
0.133 °C/W
Junction-to-lead (ball) thermal resistance
3.8 °C/W
Chip with C4 Encapsulant
Ceramic Substrate
CBGA Joint
Printed-Circuit Board
External Resistance
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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