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參數(shù)資料
| 型號： | MPC2106SG66 |
| 廠商： | MOTOROLA INC |
| 元件分類： | DRAM |
| 英文描述： | 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
| 中文描述： | 128K X 72 CACHE SRAM MODULE, 9 ns, PDMA182 |
| 文件頁數(shù)： | 10/20頁 |
| 文件大?。?/td> | 245K |
| 代理商： | MPC2106SG66 |
MPC2105A
MPC2106A
MPC2105B
MPC2106B
10
MOTOROLA FAST SRAM
SYNCHRONOUS DATA RAM WRITE CYCLE
CLK1, CLK0
ADS0
A(12, 13 – 26)
CWE0 – CWE7
STANDBY
CNTEN0
DATA IN
SINGLE WRITE
BURST WRITE
tKHKH
tKHKL
tKLKH
A1
A2
tAVKH
tKHAX
D (A1)
D (A2)
D (A2 + 1)
D (A2 + 2)
tWVKH
tKHWX
tEVKH
tKHEX
tBAVKH
tKHBAX
NOTES:
1. Cache addresses used are: 13 – 26 for MPC2105A/B; and 12 – 26 for MPC2106A/B.
2. CG0 = VIH
tSVKH
tKHTSX
tAVKH
tKHAX
D (A2 + 3)
tDVKH
tKHDX
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| MPC222225T | 制造商:AMEC THERMASOL 功能描述:HEAT SINK CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK, CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK; Thermal Resistance:10.21C/W; External Height - Imperial:0.098"; External Height - Metric:2.5mm; External Width - Imperial:0.866"; External Width - Metric:22mm; External Length - Imperial:0.866"; Heat Sink Material:Ceramic;RoHS Compliant: Yes |
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