參數(shù)資料
型號(hào)： MPC5200BV400
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 62/72頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT 400MHZ 272-PBGA
標(biāo)準(zhǔn)包裝： 40
系列： MPC52xx
核心處理器： 603e G2 LE
芯體尺寸： 32-位
速度： 400MHz
連通性： CAN，EBI/EMI，以太網(wǎng)，I²C，IrDA，J1850，SPI，UART/USART，USB
外圍設(shè)備： AC'97，DMA，I²S，POR，PWM，WDT
輸入/輸出數(shù)： 56
程序存儲(chǔ)器類型： 外部程序存儲(chǔ)器
RAM 容量： 16K x 8
電壓 - 電源 (Vcc/Vdd)： 1.42 V ~ 1.58 V
振蕩器型： 內(nèi)部
工作溫度： 0°C ~ 70°C
封裝/外殼： 272-BBGA
包裝： 托盤(pán)
MPC5200B Data Sheet, Rev. 4
Freescale Semiconductor
65
The relationship between VDD_IO_MEM and VDD_IO is non-critical during power-up and power-down sequences.
VDD_IO_MEM (2.5 V or 3.3 V) and VDD_IO are specified relative to VDD_CORE.
3.1.1
Power Up Sequence
If VDD_IO/VDD_IO_MEM are powered up with the VDD_CORE at 0 V, the sense circuits in the I/O pads cause all pad output
drivers connected to the VDD_IO/VDD_IO_MEM to be in a high-impedance state. There is no limit to how long after
VDD_IO/VDD_IO_MEM powers up before VDD_CORE must power up. VDD_CORE should not lead the VDD_IO,
VDD_IO_MEM or PLL_AVDD by more than 0.4 V during power ramp up or there will be high current in the internal ESD
protection diodes. The rise times on the power supplies should be slower than 1 microsecond to avoid turning on the internal
ESD protection clamp diodes.
The recommended power up sequence is as follows:
Use one microsecond or slower rise time for all supplies.
VDD_CORE/PLL_AVDD and VDD_IO/VDD_IO_MEM should track up to 0.9 V and then separate for the completion of
ramps with VDD_IO/VDD_IO_MEM going to the higher external voltages. One way to accomplish this is to use a low drop-out
voltage regulator.
3.1.2
Power Down Sequence
If VDD_CORE/PLL_AVDD are powered down first, sense circuits in the I/O pads cause all output drivers to be in a high
impedance state. There is no limit on how long after VDD_CORE and PLL_AVDD power down before VDD_IO or
VDD_IO_MEM must power down. VDD_CORE should not lag VDD_IO, VDD_IO_MEM, or PLL_AVDD going low by more
than 0.5 V during power down or there will be undesired high current in the ESD protection diodes. There are no requirements
for the fall times of the power supplies.
The recommended power down sequence is as follows:
1.
Drop VDD_CORE/PLL_AVDD to 0 V.
2.
Drop VDD_IO/VDD_IO_MEM supplies.
3.2
System and CPU Core AVDD Power Supply Filtering
Each of the independent PLL power supplies require filtering external to the device. The following drawing is a
recommendation for the required filter circuit.
Figure 52. Power Supply Filtering
3.3
Pull-up/Pull-down Resistor Requirements
The MPC5200B requires external pull-up or pull-down resistors on certain pins.
3.3.1
Pull-down Resistor Requirements for TEST pins
The MPC5200B requires pull-down resistors on the test pins TEST_MODE_0, TEST_MODE_1, TEST_SEL_1.
AVDD device pin
Power
Supply
source
< 1
Ω
10
Ω
200–400 pF
10
μF
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MPC5200CBV266 功能描述:微處理器 - MPU 266MHz 760MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC5200CBV400 功能描述:微處理器 - MPU 400MHz 760MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC5200CBV400B 制造商:Freescale Semiconductor 功能描述:
MPC5200CVR266 功能描述:微處理器 - MPU NO-PB IND’L 5200 266MHZ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC5200CVR400 功能描述:微處理器 - MPU NO-PB IND’L 5200 400MHZ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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