- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄17039 > MPC5553EVBE (Freescale Semiconductor)BOARD EVAL FOR MPC5553 PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC5553EVBE |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 66/68頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR MPC5553 |
| 產(chǎn)品培訓(xùn)模塊： | MPC55xx PitchPak Family |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類型： | MCU |
| 適用于相關(guān)產(chǎn)品： | MPC5553 |
| 所含物品： | 評(píng)估板和演示軟件 |
| 配用： | MFR4310FRDC-ND - FRDC FLEXRAY DAUGHTER CARD |
| 相關(guān)產(chǎn)品： | MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁當(dāng)前第66頁第67頁第68頁
Electrical Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
7
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8323E-MDS-PB | BOARD MODULE DEV SYSTEM 8323 |
| MPC5534EVBE | BOARD EVAL FOR MPC5534 |
| MPC8313E-RDBB | BOARD CPU 8313E VER 2.1 |
| STD12W-T | WIRE & CABLE MARKERS |
| STD12W-X | WIRE & CABLE MARKERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC5553EVBE | 制造商:Freescale Semiconductor 功能描述:MPC55xxEVB: MPC55xx Evaluation |
| MPC5553EVBGHS | 功能描述:開發(fā)軟件 GREEN HILLS SW Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5553EVBISYS | 功能描述:開發(fā)軟件 ISYSTEMS CONTENT Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5553MVF112 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF112R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。