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| 型號： | MPC5553MVR132 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 56/68頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU 1.5MB FLASH 132MHZ 416-PBGA |
| 標準包裝： | 200 |
| 系列： | MPC55xx Qorivva |
| 核心處理器： | e200z6 |
| 芯體尺寸： | 32-位 |
| 速度： | 132MHz |
| 連通性： | CAN，EBI/EMI，以太網(wǎng)，SCI，SPI |
| 外圍設(shè)備： | DMA，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 220 |
| 程序存儲器容量： | 1.5MB（1.5M x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 64K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.35 V ~ 1.65 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 40x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 416-BBGA |
| 包裝： | 托盤 |
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MPC5553 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
6
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Table 3. MPC5553 Thermal Characteristics
Spec
MPC5553 Thermal Characteristic
Symbol
Packages
Unit
208
MAPBGA
324
PBGA
416
PBGA
1
Junction to ambient, natural convection (one-layer board) 1, 2
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
RJA
41
30
29
°C/W
2
Junction to ambient, natural convection 1, 3
(four-layer board 2s2p)
3 Per JEDEC JESD51-6 with the board horizontal.
RJA
25
21
°C/W
3
Junction to ambient (@200 ft./min., one-layer board)
RJMA
33
24
23
°C/W
4
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RJMA
22
17
18
°C/W
5
Junction to board (four-layer board 2s2p) 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB
15
12
13
°C/W
6
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC
78
9
°C/W
7
Junction to package top, natural convection 6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
JT
22
2
°C/W
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