參數(shù)資料
型號： MPC5602BEMLLR
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 60 MHz, MICROCONTROLLER, PQFP100
封裝： 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-100
文件頁數(shù)： 7/72頁
文件大小： 971K
代理商： MPC5602BEMLLR
Electrical characteristics
MPC5604B/C Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
15
NOTE
RAM data retention is guaranteed with VDD_LV not below 1.08 V.
4.6
Thermal characteristics
4.6.1
Package thermal characteristics
4.6.2
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:
TJ = TA + (PD x RθJA)
Eqn. 1
Where:
TA is the ambient temperature in °C.
RθJA is the package junction-to-ambient thermal resistance, in °C/W.
PD is the sum of PINT and PI/O (PD = PINT + PI/O).
4 470 nF capacitance needs to be provided between V
DD_BV and the nearest VSS_LV (higher value may be needed
depending on external regulator characteristics).
5 100 nF capacitance needs to be provided between V
DD_ADC/VSS_ADC pair.
6 Guaranteed by device validation
Table 9. LQFP thermal characteristics1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions2
2 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C.
Pin
count
Value3
3 All values need to be confirmed during device validation.
Unit
Min
Typ
Max
RθJA CC D Thermal resistance,
junction-to-ambient natural
convection4
4 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets
JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA and RthJMA.
Single-layer board—1s
100
—
64
°C/W
144
—
64
Four-layer board—2s2p
100
—
50.8
144
—
49.4
Table 10. 208 MAPBGA thermal characteristics1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
RθJA CC — Thermal resistance, junction-to-ambient natural
convection2
2 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets
JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA and RthJMA.
Single-layer board—1s
TBD
°C/W
Four-layer board—2s2p
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC5604BxMG
products
in
208
MAPBGA
packages
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參數(shù)描述
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