參數(shù)資料
型號: MPC5606SCLQ6
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP144
封裝: 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-144
文件頁數(shù): 37/136頁
文件大小: 858K
代理商: MPC5606SCLQ6
MPC5606S Microcontroller Data Sheet, Rev. 7
Freescale Semiconductor
131
5
(continued)
1 Sep 2010
(continued)
Added a footnote to the “Pad type description” table.
In the “Pad type description” table:
Revised the entry for SMD.
Revised the description for the J and M2 pad types.
Revised the entry for VSSPLL in the “Absolute maximum ratings” and “Recommended
operating conditions” table.
Changed the max value for VDDPLL (was 1.32 V, is 1.4 V) in several tables.
Added the “Connecting power supply pins: What to do and what not to do” section.
In the “Recommended operating conditions” table, changed the note to state “Maximum
slew...” instead of “Minimum slew...”.
In footnote 2 of the “Recommended operating conditions” table, changed “200 F
capacitance must be connected between VDDR and VSS12” to “10 F capacitance
must be connected between VDDR and VSS12.”.
In the “Recommended operating conditions” section, added a caution on which
voltages must be the same.
In the “Recommended operating conditions (3.3 V)” table:
Revised the footnote affecting VDD12/VSS12 supply capacitances.
Deleted footnote 9.
Deleted the entries for VDDPLL and VDD12.
In the “Recommended operating conditions (5.0 V)” table:
Changed the footnote text “200 F capacitance must be connected between VDDR
and VSS12” to “10 F capacitance must be connected between VDDR and VSS12” and
revised the footnote affecting VDD12/VSS12 supply capacitances.
Added a specification for TVDD.
Deleted the entries for VDDPLL and VDD12.
Revised the “EMC requirements on board” section.
Added meaningful values to the “EMI testing specifications” table.
In the “ESD absolute maximum ratings” table, added a specification for VESD(MM).
Deleted the empty “DC Electrical Characteristics” section.
In the “I/O pad types” section, added an entry for SMD pads.
Added SMC pad electrical characteristics.
Revised the “Voltage regulator electrical characteristics” section.
Revised the “Low-power voltage regulator electrical characteristics” table.
Revised the “Ultra-low power voltage regulator electrical characteristics” table.
Revised the “Low voltage monitor electrical characteristics” table.
Added the “Recommended power-up and power-down order” section.
Added the “Power-up inrush current profile” section.
Added the “HPREG load regulation characteristics” section.
Revised the “DC electrical characteristics” table.
Replaced all values for “STANDBY mode current”.
Revised the “I/O pad types” section.
In the “I/O input DC electrical characteristics” table:
Changed the specifications for ILKG (was min = <1
A, is min = –1 A; was
max = —, is max = 1
A).
Added an entry for RON.
Revised the “I/O output DC characteristics” section.
Revised the “MEDIUM configuration output buffer electrical characteristics” table.
Revised the “SMD pad electrical characteristics” table and changed its name (is “SMC
pad...”).
In the “SMC pad electrical characteristics” table, changed RDSOH to RDSONH and RDSOL
to RDSONL.
Moved the IMAX specification from the “SMC pad electrical characteristics” table to the
“Absolute maximum ratings” table.
Table 66. Document revision history
Revision
Date
Substantive changes
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