參數(shù)資料
型號: MPC603EFE100TX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁數(shù): 14/32頁
文件大小: 149K
代理商: MPC603EFE100TX
PID6-603e Hardware Specifications, Rev 2
21
1.7.1.2 Mechanical Dimensions of the CQFP Package
Figure 11 shows the mechanical dimensions of the Motorola CQFP package.
Figure 11. Mechanical Dimensions of the Wire-Bond CQFP Package
*Reduced pin count shown for clarity. 60 pins per side
Min.
Max.
A
30.86 31.75
B
34.6 BSC
C
3.75
4.15
D
0.5 BSC
E
0.18
0.30
F
3.10
3.90
G
0.13
0.175
H
0.45
0.55
J
0.25
AA
1.80 REF
AB
0.95 REF
θ12°
θ21°
R
0.15 REF
–H–
AB
θI
R
AA
θ2
H
Pin 240
C
A
B
Pin 1
DE
*Not to scale
G
F
J
Die
Wire Bonds
Ceramic Body
Alloy 42 Leads
Notes: 1. BSC—Between Standard Centers.
2. All measurements in mm.
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