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| 型號： | MPC603EFE100TX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 |
| 文件頁數(shù)： | 25/32頁 |
| 文件大小： | 149K |
| 代理商： | MPC603EFE100TX |
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PID6-603e Hardware Specifications, Rev 2
31
1.9 Document Revision History
1.10 Ordering Information
This section provides the part numbering nomenclature for the 603e. Note that the individual part numbers
correspond to a maximum processor core frequency. For available frequencies, contact your local Motorola
or IBM sales ofce.
1.10.1 Motorola Part Number Key
Figure 18 provides the Motorola part numbering nomenclature for the 603e. In addition to the processor
frequency, the part numbering scheme also consists of a part modier and application modier. The part
modier indicates any enhancement(s) in the part from the original production design. The bus divider may
specify special bus frequencies or application conditions. Each part number also contains a revision code.
This refers to the die mask revision number and is specied in the part numbering scheme for identication
purposes only.
Figure 18. Motorola Part Number Key
Table 13. Document Revision History
Document Revision
Substantive Change(s)
Rev 2
In Table 6, the minimun processor frequency for the 100 mhz and the 133 mhz parts was
changed to 50 mhz. The maximum VCO frequency was changed to 266.66 mhz on and
the minimum VCO frequency on the 133 mhz part was changed to 100 mhz.
In Table 12 the CPU and VCO frequencies were changed to correspond to the valid clock
specications as shown in Table 6.
Table 2 includes notes on extended temperature parts.
MPC 603 E XX XXX X X
Product Code
Part Identifier
Part Modifier
Application Modifier
Max. Internal Processor Speed
(E = Enhanced)
(FE = Wire-Bond CQFP,
Package
RX = Ceramic Ball Grid Array)
Revision Level
(Contact Motorola Sales Office)
(T = Ext. Temp.Spec, -40-105°C Tj)
(L = Full Spec, 0-105°C Tj)
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