參數(shù)資料
型號(hào)： MPC603EZT200LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 200 MHz, RISC PROCESSOR, PBGA255
封裝： 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁數(shù)： 26/36頁
文件大?。?/td> 451K
代理商： MPC603EZT200LX
32
PID7t-603e Hardware Specifications
System Design Information
Figure 18. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 C/W, thus
Tj = 30C + 5C + (0.095 C/W +1.0 C/W + 7 C/W) * 3.0 W,
resulting in a die-junction temperature of approximately 60 C which is well within the maximum operating
temperature of the component.
For a PBGA package, and assuming a Ta of 30 C, a Tr of 5 C a PBGA package qjc = 8, and a power
consumption (Pd) of 3.0 Watts, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30 C + 5 C + (8 C/W + 1.0 C/W + Rsa) * 3.0 W
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 C/W, thus
Tj = 30C + 5C + (8 C/W +1.0 C/W + 7 C/W) * 3.0 W,
resulting in a die-junction temperature of approximately 83 C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakeeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
gure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat ow. The nal die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the system-level
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
Approach Air Velocity (m/s)
Heat
Sink
Thermal
Resistance
(C/W)
(25 x28 x 15 mm)
2
4
6
相關(guān)PDF資料
PDF描述
MPC603EZT200TX 32-BIT, 200 MHz, RISC PROCESSOR, PBGA255
MPC603RRX266TX 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
MPC603RRX200TX 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
MPC603RRX266LX 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
MPC603RRX300TX 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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