參數(shù)資料
型號： MPC7410THX500LE
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360
文件頁數(shù)： 2/73頁
文件大小： 929K
代理商： MPC7410THX500LE
10
MPC7410 RISC Microprocessor Hardware Specications
MOTOROLA
Electrical and Thermal Characteristics
Table 3 provides the recommended operating conditions for the MPC7410.
Table 4 provides the package thermal characteristics for the MPC7410.
Table 3. Recommended Operating Conditions 1
Characteristic
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
VDD
1.8 V ± 100 mV
V
PLL supply voltage
AVDD
1.8 V ± 100 mV
V
L2 DLL supply voltage
L2AVDD
1.8 V ± 100 mV
V
Processor bus supply
voltage
BVSEL = 0
OVDD
1.8 V ± 100 mV
V
BVSEL = HRESET
OVDD
2.5 V ± 100 mV
V
BVSEL = HRESET or
BVSEL = 1
OVDD
3.3 V ± 165 mV
V
2, 3
L2 bus supply voltage
L2VSEL = 0
L2OVDD
1.8 V ± 100 mV
V
L2VSEL = HRESET or
L2VSEL = 1
L2OVDD
2.5 V ± 100 mV
V
Input voltage
Processor bus and
JTAG signals
Vin
GND to OVDD
V
L2 bus
Vin
GND to L2OVDD
V
Die-junction temperature
Tj
0 to 105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions
is not guaranteed.
2. MPC7410RXnnnLE (Rev. 1.4) and later only. Previous revisions do not support 3.3 V OVDD and have a
recommended OVDD value of 2.5 V ± 100 mV for BVSEL = 1.
3. MPC7410RXnnnLE (Rev. 1.4) and later only. Previous revisions do not support BVSEL = HRESET.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
CBGA
Junction-to-ambient thermal resistance, natural convection,
single-layer (1s) board
RθJA
24
30
°C/W
1, 2
Junction-to-ambient thermal resistance, natural convection,
four-layer (2s2p) board
RθJMA
17
22
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min airow,
single-layer (1s) board
RθJMA
18
23
°C/W
1, 3
Junction-to-ambient thermal resistance, 400 ft/min airow,
single-layer (1s) board
RθJMA
16
21
°C/W
Junction-to-ambient thermal resistance, 200 ft/min airow,
four-layer (2s2p) board
RθJMA
14
19
°C/W
1, 3
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