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參數(shù)資料
| 型號： | MPC755BRX350LE |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 40/56頁 |
| 文件大?。?/td> | 1652K |
| 代理商： | MPC755BRX350LE |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
40
Freescale Semiconductor
System Design Information
R
N
then becomes the resistance of the pull-down devices. When data is held high, SW1 is closed (SW2 is open), and
R
P
is trimmed until the voltage at the pad equals (L2)OV
DD
/2. R
P
then becomes the resistance of the pull-up devices.
Figure 22
describes the driver impedance measurement circuit described above.
Figure 22. Driver Impedance Measurement Circuit
Alternately, the following is another method to determine the output impedance of the MPC755. A voltage source,
V
force
, is connected to the output of the MPC755 as shown in
Figure 23
. Data is held low, the voltage source is set
to a value that is equal to (L2)OV
DD
/2 and the current sourced by V
force
is measured. The voltage drop across the
pull-down device, which is equal to (L2)OV
DD
/2, is divided by the measured current to determine the output
impedance of the pull-down device, R
N
. Similarly, the impedance of the pull-up device is determined by dividing
the voltage drop of the pull-up, (L2)OV
DD
/2, by the current sank by the pull-up when the data is high and V
force
is
equal to (L2)OV
DD
/2. This method can be employed with either empirical data from a test setup or with data from
simulation models, such as IBIS.
R
P
and R
N
are designed to be close to each other in value. Then Z
0
= (R
P
+ R
N
)/2.
(L2)OV
DD
OGND
R
P
R
N
Pad
Data
SW1
SW2
(L2)OV
DD
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| MPC755CPX400LE | RISC Microprocessor Hardware Specifications |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC755BRX350TE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BVT300LE | 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BVT350LE | 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CPX350LE | 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CPX400LE | 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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