參數(shù)資料
型號(hào): MPC755BRX350LE
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: RISC Microprocessor Hardware Specifications
中文描述: 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, CERAMIC, BGA-360
文件頁(yè)數(shù): 47/56頁(yè)
文件大?。?/td> 1652K
代理商: MPC755BRX350LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
47
System Design Information
Figure 27
describes the thermal performance of select thermal interface materials.
Figure 27. Thermal Performance of Select Thermal Interface Materials
The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be
selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration
requirements. There are several commercially-available thermal interfaces and adhesive materials provided by the
following vendors:
The Bergquist Company
18930 West 78
th
St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
800-347-4572
781-935-4850
800-248-2481
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
S
2
/
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