參數(shù)資料
型號: MPC8241TZQ166D
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
封裝: 25 X 25 MM, 2.52 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-357
文件頁數(shù): 46/58頁
文件大小: 853K
代理商: MPC8241TZQ166D
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
50
Freescale Semiconductor
System Design Information
Figure 31. Thermal Performance of Select Thermal Interface Material
The board designer can choose among several types of thermal interface. Heat sink adhesive materials are
selected on the basis of high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials
are provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Sp
eci
fi
c
Ther
m
a
l
Res
is
tan
ce
(
K
-i
n
.2
/W
)
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