參數(shù)資料
型號: MPC8260ACZUMIBB
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA480
封裝: 37.50 X 37.50 MM, TBGA-480
文件頁數(shù): 40/40頁
文件大?。?/td> 527K
代理商: MPC8260ACZUMIBB
MOTOROLA
MPC8260 (HiP3) Hardware Specications
9
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
1.2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and TJ
is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving
equations (1) and (2) iteratively for any value of TA.
1.2.3.1
Layout Practices
Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The VCC power supply should be bypassed to ground using at least four 0.1 F
by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and
associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an inch
per capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and GND planes.
Table 4. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
Thermal resistance for TBGA
θJA
13.071
1 Assumes a single layer board with no thermal vias
°C/W
NC2
2 Natural convection
θJA
°C/W
1 m/s
θJA
10.483
3 Assumes a four layer board
°C/W
NC
θJA
°C/W
1 m/s
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