參數(shù)資料
型號(hào): MPC8266AZUPIBX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480
封裝: 37.50 X 37.50 MM, 1.27 MM PITCH, TBGA-480
文件頁數(shù): 50/111頁
文件大小: 1007K
代理商: MPC8266AZUPIBX
MOTOROLA
MPC826xA (HiP4) Family Hardware Specications
43
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Package Description
1.5.2
Mechanical Dimensions
Figure 14 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package.
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature
Dim
Millimeters
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter,
parallel to primary data A.
4. Primary data A and the seating
plane are dened by the spherical
crowns of the solder balls.
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